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XCZU7EV-1FBVB900E
+Lista de MateriaisIC SOC CORTEX-A53 900FCBGA
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FabricanteAMD
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Peça do Fabricante #XCZU7EV-1FBVB900E
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Especificações
| Atributo | Valor |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCZU7 |
Visão Geral
Description
A standout feature of the XCZU7EV-1FBVB900E is its highly programmable logic, utilizing Xilinx's UltraScale+ FPGA technology, which allows for extensive customization and parallel processing capabilities. The device also supports a wide range of connectivity options, including high-speed transceivers, making it suitable for communications, automotive, and industrial applications.
Integrated video codec units further enhance its multimedia processing capabilities, making it ideal for video processing applications. The package type, FBVB900, suggests a 900-ball BGA (Ball Grid Array) format, facilitating integration into complex system designs. Overall, it offers a powerful combination of processing, graphics, and programmable logic, catering to a variety of sophisticated embedded applications.
Equivalent
Features
Pinout
The key functions of the XCZU7EV-1FBVB900E include:
1. Processing System (PS): Offers powerful multicore processing capabilities for diverse computing tasks.
2. Programmable Logic (PL): Enables custom hardware accelerations and extensions.
3. High-Speed Connectivity: Supports numerous high-speed interfaces such as PCIe, SATA, and gigabit Ethernet.
4. Video Codec Unit (VCU): Provides hardware acceleration for video encoding and decoding, making it suitable for applications like video streaming and surveillance.
5. High-Level Integration: Combines multiple system components into a single chip, reducing board complexity and power consumption.
These features make the XCZU7EV-1FBVB900E suitable for a wide range of applications, including automotive, aerospace, defense, and telecommunications.
Manufacturer
Application
1. Communications: Ideal for wireless infrastructure and high-speed networking due to its high processing capacity and integrated processing systems.
2. Automotive: Supports advanced driver-assistance systems (ADAS) and in-vehicle infotainment with its powerful processing and real-time data handling capabilities.
3. Industrial: Utilized in industrial automation and control systems for its robustness and flexibility.
4. Broadcast and Pro Audio/Video: Facilitates 4K/8K video processing and live streaming applications.
5. Aerospace and Defense: Suitable for radar, electronic warfare, and secure communication systems due to its high security and reliability features.