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XC3S200A-4FGG320C
+Lista de MateriaisIC FPGA 248 I/O 320FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S200A-4FGG320C
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Pacote BGA-320
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-3A |
| Part Status | Active |
| Number of LABs/CLBs | 448 |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of I/O | 248 |
| Number of Gates | 200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Equivalent
- Spartan-3E series (XC3S200E-4FGG320C) – Similar logic capacity but lower power efficiency.
- Spartan-6 (XC6SLX4-2FGG320C) – Newer, more efficient, but pin compatibility may vary.
- Lattice ECP3 (LFE3-35EA-8FN320C) – Comparable FPGA from Lattice Semiconductor.
Check datasheets for exact compatibility.
Pinout
- Pin Count: 320 (FGG320 package, Fine-Pitch Ball Grid Array).
- Functions:
- Logic Cells: 200K (4,032 logic slices).
- I/O Pins: 221 user I/Os (supports multiple standards like LVCMOS, LVTTL, HSTL, and SSTL).
- Block RAM: 216 Kb.
- DSP Slices: None (Spartan-3A lacks dedicated DSP blocks).
- Clock Management: 4 DCMs (Digital Clock Managers) for clock synthesis & deskew.
- On-Chip Flash: No (configuration via external memory).
Designed for cost-sensitive applications, it supports 3.3V/2.5V I/O and operates at -4 speed grade (moderate performance).
Application
- Embedded Systems (control, interfacing)
- Industrial Automation (motor control, sensors)
- Consumer Electronics (displays, audio/video processing)
- Communications (protocol bridging, networking)
- Medical Devices (signal processing, diagnostics)
- Military/Aerospace (rugged, low-power applications)
Its low cost, moderate logic density (200K gates), and 320-pin BGA package make it suitable for cost-sensitive, space-constrained designs.
